How photonics technology pushes the frontiers of digitalization
How photonics technology pushes the frontiers of digitalization
Where today's conventional microelectronics technologies are approaching their limits in terms of speed, capacity and accuracy, photonics can overcome these barriers and revolutionize communication. For the steadily growing volume of data that needs to be transported and processed, photonics opens possibilities in addition to the familiar fiber-optic networks to deal with limitations in data transmission and processing.
With the rise of photonic integrated circuits (PICs) and the new challenges they bring forth, it can be tricky to keep up with evolving optical test requirements and to equip photonics labs accordingly for testing active and passive optical components by enabling speedy, accurate, and repeatable detection.
How Computer Controls comforts you to control test gears of photonics
Photonics and coherent optical technology are broadly used in data center interconnects, metro, and long-haul applications. As for example functional testing accounts for more than 30% of chip costs, we at Computer Control are at the forefront to provide and recommend cost and time efficient, automated test solutions.
Discover how we can help at your use of PICs for fiber optic telecommunications aimed at high-speed networks with solutions that shorten time-to-market, reduce cost-of-test, and enable new technologies. Improve your testing yields with R&D-grade solutions that rapidly provide best-in-class measurements. Our photonics solutions can be incorporated into any wafer-testing handling system with alignment included, provide user-friendly GUIs without any compromise on dynamic performance. They simply integrate in a research test setup or production test bench – covering your needs from lab to live!
Component and PIC Testing
Fast & innovative PIC testing systems with repeatable measurements using optical detectors.
EXFO’s fastest PIC testing system on the market integrates various components on a single chip, increasing functionality along with increased density, reducing cost of production and lowering energy requirements. Innovation in light coupling methods has made wafer-level testing possible for mass production, simplifying testing, reducing test time per unit, and avoiding bottlenecks.
Reduce Test Time, Reduce Cost
Data Center Component and Transceiver Test.
Massive growth in data center traffic is urgently driving the need for bandwidth upgrades in the data center. Data center operators require cost-effective next generation optical transceivers to support their migration from 100 gigabit Ethernet (GE) to 400GE. Test time is a significant factor that contributes to the overall cost of transceivers. This White Paper shows how efficient testing across the broad range of transceiver data rates accelerates innovation and lowers cost.
Enabling Next Generation Data Center Interconnects
A Success Story about ETH Zürich, Institute of electro-magnetic fields (IEF).
«Quod erat demonstrandum»: At the Institute of Electromagentic Fields (IEF) at ETH Zurich, Prof. Dr. Juerg Leuthold and PhD student Laurenz Kulmer were able to establish new benchmarks for plasmonic modulators using an M8199A arbitrary signal generator and a 110 GHz UXR real-time oscilloscope from Keysight Technologies. Thanks to the industry leading sample rates of the arbitrary generator and oscilloscope, both scientists have demonstrated that plasmonic modulators can achieve symbol rates of up to 220 GS/s and data rates of up to 408 Gbits/s. Read the whole story.
Programming the CTP10 components test platform
High-performance multiport detection system for passive optical component testing.
The CTP10 offers full remote control via SCPI commands and can therefore be controlled using virtually any programming language to perform fully automated measurements or to integrate the CTP10 into more complex test stations. Software examples are freely available to get quickly started with automation. This app note provides guidelines and best practices when remotely controlling the CTP10 test platform.
Testing the optical characteristics of photonic integrated circuits
How tiny but mighty photonic integrated circuits (PICs) are fueling our telecom future.
PICs bring photonics into the realm of integrated electronics by merging, in a compact design photonic components such as lasers and modulators with opto-electronic, electro-optical, fully electronic, or even RF functionalities and endless potential in applications. When it comes to optical characterization of PICs, several test solutions and measurement methods exist. This white paper covers the basic principles of optical testing directly on wafers and the best measurement methods for both active and passive components present on the PIC chip.
Tiny PICs with huge impact
Meeting the Challenges of Photonic Integrated Circuit (PIC) testing for next-generation networks.
Optical testing is currently a major bottleneck in component manufacturing due to tighter tolerances in optical wafer testing compared to electrical testing, accounting for 80% of the test and assembly cost of the final product. This Blog is about three industry innovators – EXFO, Hewlett Packard Enterprise (HPE) and MPI Corporation – who have combined forces to address the challenges posed by optical component testing with faster and more reliable measurement techniques.
Everything you need to know about complex optical modulation
Get up to speed with complex optical modulation.
Today’s CPUs and RAM in data centres ensure latencies so low that immense amounts of data can be spread over several servers within a fraction of time. To mitigate data bottlenecks and keeping the bit-rate efficiency under control in mid- and long-haul communication networks, complex optical modulation is key. Brush up your knowledge with the Keysight complex modulation compendium and let the data flow. Read the whole compendium.
Automated wafer-level testing of photonic integrated circuits
EXFO & MPI jointly demo a comprehensive testing solution for wafer disks.
This short EXFO video shows how to test photonic integrated circuits quickly and reliably by leveraging automation at the wafer level. It overviews hardware and software options allowing for multi-faceted test systems. The integrated and automated test solution by EXFO and MPI delivers speed, accuracy, scalability while keeping capital expenditure to a minimum.